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E3TAM

Hot-melt glue dot verification on carton flaps

Solution concept

Glue regions on carton flaps are imaged from the side by a thermal camera. Hot-spot position and area are compared with the expected pattern; a carton with a missing glue dot is removed by a pusher.

thermal imagehot-region areapattern matching
Information delivered

Dot count, position and area records are sent to the PLC; the missing glue region is marked in the thermal image and the carton is removed by the reject pusher.

Hot-melt glue dot verification on carton flapsILLUSTRATIVE SIMULATION
Hot-melt glue dot verification on carton flaps
  1. 01 Positioning
  2. 02 Acquire
  3. 03 Analyse
  4. 04 Decide
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The glued carton flap arrives at the thermal station.

Hot-dot count
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Hot-region area
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Scenes are illustrative simulations; they are not customer references or performance guarantees.

Need

Glue can have a similar colour to the board and flap folds hide the visible trace. Dot cooling and the board surface temperature make missing glue difficult to distinguish.

Solution approach

A side thermal camera views the region before the flap closes or the glue trace cools. Hot regions are separated relative to the board background temperature; dot centres and areas are compared with the expected flap pattern.

Process steps

  1. 01

    Positioning

    The glued carton flap arrives at the thermal station.

  2. 02

    Acquire

    The side thermal camera images hot traces on the flap.

  3. 03

    Analyse

    Dot centres and areas are compared with the expected pattern.

  4. 04

    Decide

    The missing glue dot is marked; the carton is removed by the pusher.

Vision system design

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Esentepe / İstanbul · İkitelli OSB Laboratory
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