3D volume and offset measurement of solder paste print
The bare board after printing arrives on a rail conveyor at the structured-light head. Phase-shifted stripes form a height map; paste volume and pad offset are measured, and a non-conforming board moves to a side buffer.
Volume, height and offset for each pad are sent to the board record. A board with out-of-limit print or a bridge is diverted to a side buffer before placement.
- 01 Position board
- 02 Stripe captures
- 03 Measure volume
- 04 Separate
The board stops on the rails and its references are located.
- Pad paste volume
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- Paste height
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- Print offset
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Scenes are illustrative simulations; they are not customer references or performance guarantees.
Need
Paste surfaces are reflective and variable in shape; overhead area measurement alone does not reveal volume. Print outside a pad or joining adjacent pads must be separated before placement.
Solution approach
A projector on the gantry casts phase-shifted stripes onto the board; an area camera derives a height map from the stripe images. Heights are integrated within pad regions registered to board references to obtain volume; centre offset and bridging connections are checked separately.
Process steps
- 01
Position board
The board stops on the rails and its references are located.
- 02
Stripe captures
The projector casts phase-shifted stripes.
- 03
Measure volume
The height map is combined with the pad reference.
- 04
Separate
The non-conforming board moves to the side buffer.
Related applications
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