Solder ball position and missing-ball inspection on BGA packages
A BGA package arrives on a pallet with its underside facing up. Ball centres in the overhead image are matched to the nominal grid; a package with a missing or shifted ball is separated.
Ball count and maximum centre deviation are sent to the PLC record. A package with a missing or displaced ball is pushed with its pallet into the side reject area.
- 01 Infeed
- 02 Acquire
- 03 Match
- 04 Separate
The pallet carries the package to the overhead camera.
- Detected balls
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- Centre deviation
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Scenes are illustrative simulations; they are not customer references or performance guarantees.
Need
Shiny solder balls create specular highlights; locating only the bright spot can shift the estimated centre. Package position must be distinguished from an actual ball displacement.
Solution approach
A telecentric view and controlled ring light reveal ball outlines from above. Circle centres are matched to a nominal grid registered to the package reference; an unmatched position indicates a missing ball and a centre difference indicates displacement.
Process steps
- 01
Infeed
The pallet carries the package to the overhead camera.
- 02
Acquire
The ring light illuminates ball outlines.
- 03
Match
Centres are compared with the grid at the package reference.
- 04
Separate
The non-conforming package is diverted with its pallet.
Related applications
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