Local solder-bridge mapping between display-connector pads
A full-board view may not resolve solder connections in narrow pad gaps. Bright solder and pin occlusion can resemble a bridge, so local inspection needs its own magnification and visibility evidence.
Proposed output: pad-pair-linked visual bridge candidate, local image and review reason. This is a separate optical concept, not automatically part of full-board AOI or electrical short-circuit testing.
- 01 Presentation
- 02 Trigger and reference
- 03 Image / profile
- 04 Decision
- 05 Evidence and PLC
Register the connector ROI
- Sample record
- —
- Pad-gap and view validity
- —
- Acquisition progress
- —
Scenes are illustrative simulations; they are not customer references or performance guarantees.
Solution approach
Align the connector region to a local reference and compare controlled-light views. Segment pads and solder, then identify connection candidates between adjacent pads. Keep glare and occlusion as separate invalid states. Validate local resolution and bridge discrimination on real samples; do not infer an electrical short.
Process steps
- 01
Presentation
Register the connector ROI
- 02
Trigger and reference
Acquire controlled-light views
- 03
Image / profile
Segment pads and solder
- 04
Decision
Inspect adjacent-pad connection candidates
- 05
Evidence and PLC
Link visual evidence to the review record
Related applications
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We test your sample in our laboratory and report on resolution, optics and lighting selection.